Development of High Heat Resistant Molding Compound for Next-Generation Power Devices by Using Bismaleimide Resin Modified with Benzoxazine - I-Scover metadata
ARTICLE

Development of High Heat Resistant Molding Compound for Next-Generation Power Devices by Using Bismaleimide Resin Modified with Benzoxazine

Metadata details

now loading...

Related ARTICLE(s)

now loading...

Related metadata

now loading...

Search by external websites

now loading...

Login 日本語