Implementing an Optical Interconnect Integrated Circuit on a Single Silicon Substrate with 3.5 Tbit/(s・cm2) Transmission Density : A Prospect for Further Scaling Down from a Printed Circuits Board into a Chip - I-Scover metadata
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Implementing an Optical Interconnect Integrated Circuit on a Single Silicon Substrate with 3.5 Tbit/(s・cm2) Transmission Density : A Prospect for Further Scaling Down from a Printed Circuits Board into a Chip

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